Affect the LED luminous efficiency of heat dissipation efficiency factors are as follows.

1) LED heat sink substrate, heat sink selection and packaging materials, a key indicator is to choose low thermal resistance of materials.

2) thermal conductivity between the materials to each successive match, requiring thermal connection between the various structures of good structural thermal resistance should be small, there is no bottleneck thermal cooling channel structure design.

3) Specifically, increasing the chip area; flip-chip structure, the chip bumps directly mounted on the silicon carrier heat sink; forced cooling method using the heat generated export, and as quickly as possible, which are some of the practices better heat dissipation effect of the test solution.

Currently, the general scheme of LED industry application manufacturers for later downstream from the upstream particle LED lamp manufacturers, the lamp is welded to the particle PCB (printed circuit board, printed circuit board) circuit pattern surface of the PCB and then the thermal adhesive on the metal plate heat sink on. This is one of the industry's current general scheme of LED lights. LED, PCB board circuit by connecting, aluminum plate as a heat sink with heat, micro heat pipes and aluminum fins are designed to further enhance the cooling effect, and thus ensure maximum luminous efficiency of LED lights，such as LED panel lights, LED down lights.